BGA Rework Station
Accurate repair of Ball Grid Array (BGA) components is critical for restoring circuit integrity in modern electronics. At MES, we offer full-service BGA rework solutions, including chip removal, reballing, resoldering, and functional testing using precision-controlled rework stations.
Our services help preserve valuable boards—from automotive ECUs to industrial PCBs—by addressing BGA soldering issues like cracked joints, thermal damage, and misalignment using industry-standard equipment and processes.
Our Expertise Includes:
- Precision Component Removal — Controlled heating using hot-air or infrared systems for safe BGA extraction
- Pad & Board Cleaning — Meticulous solder residue removal and pad surface prep
- Reballing & Reinstallation — Accurate alignment and solder joint formation with optical systems
- Thermal Profiling & Reflow — Fully controlled temperature profiles for reliable soldering
- Microscopic & X-Ray Inspection — Post-rework quality validation to detect voids or misalignment
Industries We Serve
MES, specializes in advanced electronics and mechanical repair services along with hands-on training programs. Here’s a breakdown of the industry segments they cater to:
Automotive & ECM Applications
Advanced repair and diagnostics for ECM modules in vehicles.
IoT, Wearables, Smart Devices
PCB design and control systems for compact, connected gadgets.
Industrial & Automation Controllers
Magazine and housed in a gilded in frame.
LED Lighting & Power Systems
Magazine and housed in a gilded in frame.
Battery Management Systems (BMS)
Customized PCB designs for efficient power and battery control.
Embedded Systems & Microcontroller Boards
Magazine and housed in a gilded in frame.
Why Choose MES Services Ajmer?
At MES Services Ajmer, we don’t just repair — we solve problems. Backed by years of experience and a passion for precision, we are trusted by technicians, fleet operators, and learners across India for our quality service and result-driven training. Here’s what makes us stand out.
Years Experiences
Quality Products
Satisfied clients
Got Questions? We’ve Got Answers!
We handle a wide range including PBGA, uBGA, LGA, QFN, PoP, and others commonly found in automotive and industrial electronics.
Yes. We offer both rebelling and full BGA reintegration with precise control and reflow profiling.
We use optical alignment systems and X-ray microscopy to verify solder joint integrity post-rework.
Absolutely. Using bottom preheat and focused top heating, we minimize thermal stress and protect nearby parts.
Yes. BGA rework often salvages boards that are beyond standard repair-saving time and cost.
